Description
Circuit Board Solder Masks. Designed to withstand high-temperature applications where clean removal is necessary. 1 mil polyimide film does not leave any adhesive residue. Not available on zip strip cards. Transparent die-cut masks withstand solder fluxes, molten solder and cleaning/degreasing solvents used in the manufacture of printed circuit boards. B-654 High Temperature Polyimide Film with removable silicone adhesive from Brady® leaves no residue when removed from most surfaces. Withstands solder fluxes, molten solder and cleaning/degreasing solvents used in the manufacture of printed circuit boards. Good smudge, chemical, oil and water resistance
Specification
Data-sheet: Download here
Thickness: 0.064 mm
Adhesive Type: ["Removable Silicone"]
Brady Material Number: B-654
Finish: Label Properties: Material: Material Type: Maximum Service Temperature: 240 °C
Ressistance Properties: Applications: Colour: Printer & Label Applications:
Shape: Circle